Abstract
The tungsten-copper (W-Cu) duplex structure for use as a divertor plate is a reference design concept in the FER (Fusion Experimental Reactor). In the present study, durability tests of the W-Cu duplex structures against thermal fatigue were carried out. The W disk was bonded to the Cu disk by means of brazing. The W surface of the test piece was periodically exposed to a high temperature Ar plasma jet. Before and after the tests, the specimens were examined with the aid of a scanning electron microscope and the Knoop hardness was measured. Grain boundary cracks were observed in the W with a small quantity of Ni and P for 200 and 1, 100 thermal cycles. But, microcracks were not observed in the W with an extremely small quantity of impurities, even for 3, 700 thermal cycles. Microcracks were observed in the brazing material of this specimen. None of them were broken. Consequently, it is found that the bonding method of the brazing is effective and that the W-Cu duplex structure is fully resistant against thermal fatigue.
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