Abstract
Poly(amic acid)s were successfully synthesized from 1,4-bis(4-aminophenoxy)benzene (1,4-APB) or 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) with pyromellitic dianhydride (PMDA), 3,3'-4,4'benzopenonetetracarboxylic dianhydride (BPDA) and p-phenylenediamine (p-PDA) and then they were effectively converted into polyimide films by thermal imidization. The chemical structure and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FTIR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer, dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The moisture absorption, thermal and mechanical properties of polyimide films decreased with increasing the amount of 1,4-APB and HFBAPP. The polyimide films using HFBAPP showed lower properties than that of 1,4-APB at the same ratio, but it displayed better thermal properties and lower moisture absorption at the similar coefficient of thermal expansion (CTE) with a copper. On the basis of our finding, it is concluded that 4component polyimide films could be utilized for base films for flexible copper clad laminates (FCCL) of flexible printed circuit boards.
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