Abstract

We developed a technique for revealing and analyzing volumetric surface defects based on geomorphometric modeling, in particular, an analysis of models and maps of some morphometric variables (minimum curvature, maximum curvature, mean curvature, Gaussian curvature, unsphericity, etc.), derived from digital elevation models of a surface. The technique allows one to reveal areas of individual volume defects (cracks, film delaminations, shape deviations, etc.), to determine shape and size of both the defects themselves and adjucent modified areas, as well as to study patterns of their distribution. The technique effectiveness is exempified by defects on silicon–glass and silicon–silicon wafer assemblies, as well as a cracked Ni–W film. The technique can be promising for quality control of manufacturing and diagnostics of damages of various items, in particular, microelectronic products.

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