Abstract
The compressive-type fracture of vacuum-evaporated gold films was observed directly in a scanning electron microscope and a transmission electron microscope by mounting the film on uniblock substrates. Gold films from 400 to 3400A in thickness used in this study were heated at different temperatures ranging from 300 to 800 °C. It was shown that as-evaporated films fractured in a smooth straight-line type while heated films exibited a graininterior type fracture. The predominant propagation for fracture of thicker films (>700A) occurred within the grain-interior by the formation of dislocation fissure. The total fracture strain of the film was usually of the order of 0.2 to 4.8% at fracture. The measurements showed that for thickness thicker than about 1000A there was an increase in the strain with increasing thickness.
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