無機・有機材料の接合技術の展望

Abstract

Bonding technology for both inorganic and organic materials is reviewed in terms of the low temperature process. Especially the surface activated bonding (SAB) which has been developed recently may offer an key technology enabling room temperature bonding. Metals and semiconductors as well as ionic materials including oxides, nitrides, and carbides can be bonded directly at room temperature. A concept of nano-adhesion layer of Fe with Si inserted into the interface as an intermediate extends the possibility of the SAB method on bonding even polymer materials at room temperature without organic adhesive.