Abstract
Parallel gap resistance welding of Ag plated 0.18 mm diameter oxygen free copper wires to Au+ Ni plated of Printed circuit boards (P/B) was investigated (concerning Au plating). The results are summarized as follows.(1) Au plating bath for Good Micro Welding is composed Cobaltion 0.35-3 gf/l [5.9-51 mol/m3] and Nickelion 0.02-0.5 gf/l [0.34-8.5 mol/m3], after Au plate it's composition of Co 0.2-3% and Ni 0.4-2% except Au :(2) Cobalt content and Nickel content beyond the allowable limit are Bad Welding for Au plating, they cause Blow hole in the weld fillet and decrease weld strength.
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