Abstract
This paper presents a methodology (Computer Aided Principle CAP) of quantifying the interaction of each design factor for helping the design engineers to understand the complicated design principle. In this method, correlative parameters are extracted by using a cluster analysis with parametric study. The results can supply a guidance to the engineer for understanding the fundamental mechanism of the structural phenomena. The CAP is applied to two design problems. An numerical example of an offset frontal, crash against deformable barrier (ODB) is demonstrated to express the effectiveness of the presented method. And thermal fatigue reliability of BGA solder joints was assessed with the consideration of the interaction between design factors, and it is made clear that fatigue mechanism can be understood easily by the warpage of BGA and PCB.
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