Abstract
Homogenization behavior in TLP-bonded joints of Ni-base single crystal superalloys, CMSX-2 and CMSX-4 were investigated using MBF-80 and F-24 insert metals. CMSX-2 and CMSX-4 were bonded at 1523-1548 K for 1.8-2.4 ks in vacuum. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. The homogenizing in the bonded interlayer of TLP-bonded joint was evaluated in terms of microstructures, line profile of elements analyzed by EPMA and microhardness distribution. Homogenization of the bonded region was attained quickly when the bonding temperature was increased. The microstructures, alloying elements and hardness distributions in the bonded interlayer following homogen-ization at 1523 K for 18 ks became uniform with those in the base metal. From the analyses of the bonded region following the solution treatment at 1589 K for 7.2 ks without any homogenization treatments, joint homogenization took place during the solution treatment. The homogenization treatment could be substituted by the sequential post-bonded heat treatments as solution treatment.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
