Abstract
The algorithm for predicting the intimate contact process in the solid state diffusion bonding has been developed. The numerical model proposed in our previous study (Part 1) was updated to predict the void shrinkage process in the final stage of bonding.The influence of dispersion of void spacing on the contacting process was examined based on the calculated results. The plural measurements of surface profiles was performed to estimate the variation of the bonding process. The distribution of void spacing estimated by the overlap method was also examined. It was useful to take into account the largest void spacing and the largest void volume for the prediction of the final stage. The algorithm was verified experimentally. It was indicated that the algorithm predicts the time taken to attain the full contact.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
