Ａｌ‐Ｃｕ‐Ｓｉ系低融点ろう材を用いた窒化けい素セラミックスとアルミニウム合金の接合

Abstract

In the joining of aluminum alloy/silicon nitride ceramic, the possibility of the application as a brazing filler metal of the Al-27.1%Cu-4.7%Si ternary eutectic alloy was examined. In the joining at the 833 K in the nitrogen atmosphere, the joining strength were obtained about 65 MPa, and it was clarified that the joining of ceramic and aluminum alloy was possible. Because of the relationship between the joining strength and the existence ratio of Al2Cu at the joining interface, it was considered that Mg, which was included in aluminum alloy, caused the decomposition of aluminum alloy oxidation scale and promoted the diffusion of Cu, and reduced the deposition of Al2Cu.