Abstract
Electrodeposited tin-silver alloys show promise as lead-free alternatives to solder coating. Eutectic tinsilver alloy film was deposited at 2∼3A/dm2, 25°C, and pH 8 using the following bath composition: 0.19M SnCl2, 0.01M CH3COOAg, 1.0M L-tartaric acid, and 0.2M N-acetyl-L-cysteine. The presence of N-acetyl-L-cysteine markedly promoted silver deposition over a noble potential range.The eutectic tin-silver alloy film consisted of β-Sn and e (Ag3Sn) phases, and its solidus temperature was 221°C. An intermetallic compound layer (Cu6Sn5) was formed at the interface of the alloy film and copper substrate in heat treatment, forming a Sn-Ag-Cu ternary eutectic (m. p. 217°C) with reactions of Cu6Sn5 and e (Ag3Sn) phases.
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