Abstract
The solubility in the α-phase of the Al-Cu-Sn alloy was studied by means of electrical resistivity and lattice spacing measurements. From the isothermal sections of the phase diagram at 520, 500, 480 and 460°C, it was found that the addition of Sn to the Al-Cu alloy had little effect on the solubility of Cu in the α-phase. This observation led to conclude that the aging suppression in the Al-Cu-Sn alloy was not explained by the significant decrease of Cu contents in the α solid solution.
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