Abstract
피로인산구리용액에서 전기도금공정을 이용하여 상온과 <TEX>$55^{\circ}C$</TEX>에서 각각 제조된 Cu박막의 특성에 미치는 전류밀도, 도금용액 온도, pH의 영향에 대한 연구를 수행하였다. 전류효율은 전류밀도가 증가함에 따라 감소하였으나, 도금용액의 온도가 증가함에 따라 증가하는 경향을 나타내었다. 그러나 pH 는 전류효율에 거의 영향을 미치지는 않았으며, 상온과 <TEX>$55^{\circ}C$</TEX>에서 모두 90% 이상으로 측정되었다. 상온에서 전기도금 된 Cu 박막의 잔류응력은 전류밀도의 증가에 따라 감소하며, 60 <TEX>$mA/cm^2$</TEX> 이상에서는 거의 0에 근접하였다. <TEX>$55^{\circ}C$</TEX>에서 전기도금 된 Cu 박막은 0~40 MPa의 잔류응력을 나타내었다. 상온에서 도금하는 경우 수지상 표면 형상이 30 <TEX>$mA/cm^2$</TEX> 이상의 전류밀도로부터 관찰되었고, <TEX>$55^{\circ}C$</TEX>에서는 100 <TEX>$mA/cm^2$</TEX> 이상의 전류밀도부터 관찰되었다. 상온과 <TEX>$55^{\circ}C$</TEX>의 도금용액으로부터 전기도금 된 Cu 박막은 거의 (111) 피크들로 구성되어 있다. 특히 <TEX>$55^{\circ}C$</TEX>, 30 <TEX>$mA/cm^2$</TEX>에서 전기도금 된 Cu 박막의 경우 (111) 피크의 강한 우선방향을 나타내었다. Effects of current density, electrodeposition temperature and solution pH on properties of Cu thin films electrodeposited from pyrophosphate bath were investigated. Current efficiency was decreased with increasing current density and increased with increasing temperature. But solution pH slightly influenced on current efficiency and current efficiency was measured to be above 90% at both room temperature and <TEX>$55^{\circ}C$</TEX>. Residual stress of Cu thin film electrodeposited at room temperature was decreased with increasing current density, while current density reaches to 60 <TEX>$mA/cm^2$</TEX> or more, stress became close to zero. Cu thin films electrodeposited at <TEX>$55^{\circ}C$</TEX> exhibited the residual stress range of 0~40 MPa. At room temperature, dendritic surface morphology was observed above the current density of 30 <TEX>$mA/cm^2$</TEX> and at <TEX>$55^{\circ}C$</TEX>, above the current density of 100 <TEX>$mA/cm^2$</TEX>. Cu thin films electrodeposited from bath solution with room temperature and <TEX>$55^{\circ}C$</TEX> mainly consisted of (111) peaks. Specially, Cu thin film electrodeposited at 30 <TEX>$mA/cm^2$</TEX> and <TEX>$55^{\circ}C$</TEX> exhibited strong preferred orientation of (111) peaks.
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