Abstract

(Ti, Al)N films having various composition ratios of Ti and Al were deposited onto a hard alloy substrate by reactive RF sputtering using a single power source, the power from which was split by a variable coupling capacitor. A series of (Ti, Al)N specimens was obtained by changing voltage in a mixed argon-nitrogen atmosphere.Film composition were measured by X-ray diffraction and EPMA.The results showed that all the (Ti, Al)N films showed homogenous distribution of Ti and Al. X-ray patterns showed obvious formation of TiN for concentrated Ti side and AlN formation for Al riched side.Those (Ti, Al)N films having Ti-to-Al ratios approximating 1 1 were amorphous. Hardness of the films was from Hv1200 to Hv1300.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call