Abstract
We studied the development of alkaline and electroplating baths of Sn-Ag binary alloy using 5, 5-dimethylhydantoin (DMHy) as a Pb-free solder plating bath under various conditions, such as metal content, complex agent concentration, pH, current density and bath temperature. From these results, e. g., adding large amount of DMHy, pH 10.5, high current density, etc., electroplating films of Sn-Ag alloy having eutectic and constant composition were obatined. Surface morphology and solder wetting time of Sn-Ag alloy electroplating films become roughened with increasing film thickness. The melting point of Sn-Ag alloy electroplating films was about 221°C, similar to that of Sn-Ag ingot, and its phase structure consisted of eutetic structure of β-Sn and the e phase (Ag3Sn).
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