Abstract
A new electroless tin plating bath has been examined. The bath is unique in that it has no reducing agent, hence tin is formed not by reduction, but through a spontaneous disproportionation reaction in which stannous ions dissociate to form tin and stannate ion.2 Sn(OH)3-→Sn+Sn(OH)2-6(Sn(II)) (Sn(0))(Sn(IV))The following results were obtained.1. Stability of the bath was strongly dependent on the concentration of Sn (II) and NS ratio-the molar ratio of NaOH to Sn (II). The bath was stable with in a certain range of NS ratios, which became narrower with increases in Sn (II) concentration. At lower ratios, stannous oxide precipitate formed, while at higher ratios disproportionation occurred.2. The deposition rate increased with increases in Sn (II) concentration and temperature, but was nearly constant independent of NS ratio when Sn(II) concentration was held constant.3. The optimum bath composition was found to be Sn(II)0.4M, NaOH 5.2M, sodium citrate 0.9M, and deposition rates as high as 5.6μm/h were obtained at 80°C.
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