Abstract
A method for predicting the mold-filling and curing dynamics associated with heat generation caused by the chemical reaction of epoxy compounds has been developed. To verify this method, transient temperature profiles were measured during the mold-filling and curing process for two kinds of compounds used for encapsulation of semiconductor devices. After the completion of fill, temperature exceeded the mold temperature. The calculated temperature profiles for both compounds fit well with the experimental data. Calculated cure profiles showed that the cure was faster near the wall than at the center due to a quick temperature rise produced by heat conduction from the mold. On the other hand, within the usual filling time, the degree of cure remained very small. Calculated viscosity profiles were compared between this new model and the conventional model, which neglects heat generation, for two kinds of circular flow channels. Differences in the viscosity profiles were not found under several molding conditions due to the small curing advancement up until gelation.
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