Abstract
In this paper we show that the photoresist-protective film of a printed circuit board (PCB) can be delaminated from the underlying photoresist layer by a single pulse of a nanosecond laser at 532 nm. After locally peeling the edge of the PCB with a laser beam of 9 mm size, Scotch tape was attached to the irradiated region to peel off the whole protective film. For a certain range of pulse energies the peeling probability was 100%, without leaving any damage. Since the use of a laser in initial delamination is noncontact and nondamaging, it may be more efficiently utilized in the PCB industry than the conventional knurling method based on mechanical pressing.Keywords: Pulsed laser, Laser-driven delaminationOCIS codes: (140.3538) Lasers, Pulsed; (140.3390) Laser materials processing
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