Abstract
Control modules should be reliable to sustain high precision semiconductor processing. High demand for those miniaturization and multifunctioning induces the increase of waste heat density so that effective thermal management of those is crucial. Two thermal packaging methods for the control module have been introduced, and then computational fluid dynamics (CFD) and thermal network models have been generated. The thermal performances of those with two packaging methods have been computationally analyzed. The CFD models have investigated parametric influences of incident air velocities, thermal interface materials, and via parameters on those thermal performances. The result reveals that the proposed thermal packaging method could drastically improve the thermal performance of the primary components by nearly up to 50%. It also finds that the influence of the number of vias is dominant compared with other via parameters on the thermal performance of the controller module.
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