수치해석을 통한 히트싱크 형상에 따른 열특성 분석

Abstract

Recently, optimum fin design involved with its geometries is important to improve the heat transfer performance without increasing fin number. When the junction temperature of a semiconductor reach over its maximum allowable design limit, the device will be broken down. One of the common and conventional method to remove the generated heat is using a finned heat sink with high thermal conductive material. And it is directly contacted to the heat source surface of the electronic component. Heat sink usually consists of a flat base with lots of fin arrays to increase the heat transfer area. The greater the surface area, the better it is able to dissipate the heat generated. The most usual cooling methods could be natural or forced convection with typical fluid cooling mediums. In the present study, the non-uniform geometrical pin-fin arrays are studied in terms of effects of fluid flow, different fin geometries, and so on. Three different fin geometries were used to study and compared to each other to determine the most efficient heat transfer performance. The goal of study is to optimize heat transfer performance of the heat sinks studied in a range of configuration based on fin geometries. The simulation shows slight variation with different geometries. The flow direction to the highest fin is allowable to get higher heat transfer performance.