Abstract
New finishing method has been developed by using the electrophoresis phenomenon of fine grain suspehded in liquid, which yields the electrical double layer at the surface of the grain. When the electric power is supplied to electrode set into the polishing compound, the grain moves and causes the polishing action to the workpiece surface.- The developed polishing equipment consists of a rotary vessel containing the polishing agent. The experiments were conducted on silicon wafer and ferrous metal specimen using the distilled water or ethylalcohol mixed with fine abrasive grain (Al2O3, SiO2) at the 10-2% volume concentration. The experimental results on the silicon wafer which is placed apart from the electrode showed that the stock removal rate increases with increasing the applied potential. Examination of the surface profile of the polished specimen indicated that the surface roughness decreases with increasing the potential. It can be said that the surface finishing characteristics are controllable by varying the current to the electrode.
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