Abstract
In this paper, a method of combining numerical analyses and experimental tests is used to evaluate fracture toughness of copper thin films of 15 �m thickness. Far-field loadings of a global-local finite element model are inversely estimated by matching crack opening profiles in experiments with numerical results. The fracture toughness is then evaluated using the J-integral for cracks in thin films under far-field loadings. In experiments, Cu thin films attached to Aluminum sheets are loaded indirectly, and crack opening profiles are observed by microscope camera. Stress versus strain curves of Cu thin films are obtained through micro-tensile tests, and the grain size of Cu thin films is observed by TEM analysis. The results show that the fracture toughness of Cu thin films with 500 nm ~ 1 �m sized grains is 6,962 J/m 2 .
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