Abstract
The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. <TEX>$NH_4OH$</TEX> and <TEX>$NH_4NO_3$</TEX> were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from <TEX>$0.08{\mu}m$</TEX> to <TEX>$0.03{\mu}m$</TEX>. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
