자동차 전장품용 무연솔더 접합부의 시리즈 시험 유효성

Abstract

Abstract Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and auto-motive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reli-ability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was per-formed at -40~125 ℃ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat pack-age (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.Key Words : Pb-free solder, Solder joint, Series reliability, Automotive electronics, DegradationISSN 1225-6153Online ISSN 2287-8955