Abstract
Moire interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic moire interferometry. The method is an extension of the moire interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of moire interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 ㎚ per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.
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