ВЛИЯНИЕ ПРИМЕСЕЙ НА ДЕГРАДАЦИЮ СОЕДИНЕНИЙ В СИСТЕМЕ Al – Au

Abstract

Typical reasons for degradation of micro–welded bimetallic compounds of the aluminum-gold binary system are considered. These types of compounds are often used in the manufacture of semiconductor products (SCPs) and integrated circuits (ICs). Degradation of compounds, revealed during screen tests or during products operating, leads to failures, which dramatically reduces the reliability of electronic equipment (EE). The majority of degradation processes are based on diffusion phenomena, which are mainly determined by temperature, chemical composition and microstructure of metals and alloys. Impurity elements included in the gold coating have a significant effect on the degradation of the wire connections such as crystal contact pads – traverses of package terminals of SCPs. In this regard, it is worth analyzing the effect of various impurities on the diffusion processes and changes in the microstructure of the coating in order to find out the most dangerous chemical elements and determine their role in the degradation of compounds. The paper presents a review of references on the research subject. In the conclusion, the results of analysis in the field of the influence of impurity elements on the degradation of compounds in Al – Au system are summarized, conclusions are drawn about the key role of grain-boundary diffusion on the degradation of micro-welded bimetallic compounds.