Abstract
In semiconductor manufacturing processes, the final inspection is a crucial last test stage for screening defective parts before delivery to customers. Since traditional convection-based temperature control has limitations and requires time for a solution, this study focuses on the development and verification of an automatic temperature control technology using conduction-based thermoelectric modules. From the performance tests, it is found that the module operates in the temperature range of –40℃ to 120℃, and all channels achieve temperature transitions at each step within 6 min. The temperature module shows accuracy variations of –0.8℃ to 1.9℃ over the entire stage, which fulfills the semiconductor industry requirement of within ±2℃ for inspection equipment.
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