Abstract
School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, Gyeonggi-do 16419, Korea(Received October 14, 2015 ; revised October 28, 2015 ; accepted October 30, 2015)AbstractIn recent years, the cleaning and activation technology of surfaces using atmospheric plasma as well asthe deposition technology for coating using atmospheric plasma have been demonstrated conclusively anddrawn increasing industrial attention. Especially, due to the simplicity, the technology using atmospheric plasmaenhanced chemical vapor deposition has been widely studied from many researchers. The plasma source typecommonly used as the stabilization of diffuse glow discharges for atmospheric pressure plasma enhancedchemical vapor deposition pressure is the dielectric barrier discharge. In this review paper, some kinds ofmodified dielectric barrier discharge type will be presented. And, the characteristics of silicon based compoundsuch as SiOx and SiNx deposited using atmospheric plasma enhanced chemical vapor system will be discussed.
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