Abstract
The analysis of heat transfer in the contact-film-substrate system under conditions when the heat removal from the sample to the substrate is insufficient to ensure that the sample is not overheated. For low temperatures, a method is proposed for increasing the heat removal from thin-film samples by passing a high-density electric current through them. The property of an anomalously high thermal conductivity of copper at temperatures from 5 to 50 K was used as the main factor in enhancing heat removal. The heat equation for the film-substrate system was numerically solved under the condition of additional heat transfer to potential contacts. It has been shown that beryllium bronze contacts can provide efficient heat removal from samples of superconducting films in a resistive state under conditions of strong Joule heat release.
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