Abstract
The article analyzes the properties of conductive inks and substrates for their application. Experimental data reflecting the relationship between the chemical composition and physical properties of the ink solution are shown. The properties of electrical conductivity and ease of application to the substrate are described. This article presents a combination of filler and binder solutions in conjunction with the production technology of conductive ink. The advantages and disadvantages of various combinations of solutions and their application for further three-dimensional formation of boards are evaluated. The article describes the behavior of polymer solutions for use in existing three-dimensional printing technologies.
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