Формирование дефектного слоя при лезвийной обработке хрупких материалов

Abstract

Parts made of modern brittle materials with high quality finish are widely used in manufacturing of optical and electronic devices as well as crucial assemblies in mechanical engineering products. Diamond machining enables generation of geometry without affecting the functional surface layers by heat. At the same time, brittle material cutting is accompanied by the formation of a defective layer on the machined surface due to the structural disturbances in the material caused by the applied cutting force. The paper discusses causes and the mechanism of the defective layer formation on the machined surface during non-free cutting of brittle materials and examines ways of reducing the size of the defective layer. Theoretical and computer-aided analysis is performed to determine the impact of the local stresses field in the zone of concentrated pressing force acting on the brittle plate surface. Using experimental methods, a defective layer formed after cutting notches on a silicon plate by a diamond tool is studied.