대기압 플라즈마의 선택적 도핑 공정에서 온도에 의한 인(Phosphorus)의 확산연구

Abstract

Kwangwoon University of Department of Chemistry, Seoul, Korea(Received October 8, 2014 ; revised October 22, 2014 ; accepted October 23, 2014)Abstract In this study, we propose the application of doping process technology for atmospheric pressure plasma.The plasma treatment means the wafer is warmed via resistance heating from current paths. These pathsare induced by the surface charge density in the presence of illuminating Argon atmospheric plasmas. Fur-thermore, it is investigated on the high-concentration doping to a selective partial region in P type solarcell wafer. It is identified that diffusion of impurities is related to the wafer temperature. For the fixed plasmatreatment time, plasma currents were set with 40, 70, 120 mA. For the processing time, IR(Infra-Red) imagesare analyzed via a camera dependent on the temperature of the P type wafer. Phosphorus concentrationsare also analyzed through SIMS profiles from doped wafer. According to the analysis for doping process,as applied plasma currents increase, so the doping depth becomes deeper. As the junction depth is deeper,so the surface resistance is to be lowered. In addition, the surface charge density has a tendency inverselyproportional to the initial phosphorus concentration. Overall, when the plasma current increases, then it becomeshigher temperatures in wafer. It is shown that the diffusion of the impurity is critically dependent on thetemperature of wafers.