Abstract
스퍼터링 방법으로 FM/M/FM의 다층박막을 증착한 다음 초소형 박막 인덕터를 제작하기 위하여 반도체 공정을 대체할 수 있는 레이저 미세가공 기술을 개발하였다. TE <TEX>$M_{00}$</TEX> 모드로 발진하는 CW Nd:YAG 레이저를 active Q-switching 하여 펄스폭이 200 ns인 극 초단 레이저 펄스를 얻었다. 레이저 미세가공 조건을 반복율 5 kHz, 펄스 당 에너지 5 mJ/pulse로 최적화 하여 분해능이 20 <TEX>$\mu\textrm{m}$</TEX>인 line patterning을 얻었다. We have developed laser micro-machining technology for fabrication of the micro thin-film inductors. After the thin layers of FM/M/FM films were coated to the silicon substrate by using the conventional sputtering method, the new laser machining was applied to the patterning process that used to be carried out by the semiconductor lithography procedure. A CW Nd:YAG laser operating in TEM<TEX>$\sub$</TEX>00/ mode was actively Q-switched to obtain the very short pulse of 200 ns. The laser micro-machining process with pulse energy and repetition rate have been optimized as 5 mJ/pulse and 5 kHz, respectively, to obtain the line resolution as fine as 20 <TEX>$\mu\textrm{m}$</TEX>.
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