Abstract
This paper presents a method for the efficient simulation and analysis of connector designs. Connectors used in a high-frequency system comprise various materials. Matching the impedance of the discontinuous part of the internal lines is difficult, owing to their complex structures. Therefore, it is essential to predict and modify the impedance discontinuity at the design stage. Moreover, the process of predicting the characteristics through electromagnetic (EM) simulations is essential to detect the deterioration in the performance of the connector installed in the system and the electromagnetic coupling between the boards. Therefore, the accuracy and time required for the simulations are important factors to be considered at the design stage of the connector. This paper proposes an assembled EM simulation method, which observes the scattering (S) parameter and time domain reflectometer impedance by performing transient analysis. To reduce the difference from the full EM simulation, the number of parts to be analyzed should be minimized. Thus, the full model is divided into connectors and peripheral systems to extract 8×8, 16×16, and 2×2 S-parameters of the Sub-Miniature version A connector, which is used for measurement. By comparing the results of the full EM simulation, the assembled EM simulation, and the measurement, the assembled EM simulation method proposed in this paper is validated.
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More From: The Journal of Korean Institute of Electromagnetic Engineering and Science
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