Abstract
The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at . The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor () of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from to in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
