Abstract
The article gives an outline of linear thermal models of digital integrated circuits (DIC) and methods for measuring transient thermal characteristics (TTC). It specifies the disadvantages of the methods for measuring the TTC of DIC according to the JESD51-1 Standard using DIC protective diodes as heat sources and temperature sensors and the method using the oscillation frequency of a ring generator built on DIC logic elements as a temperature-sensitive parameter. A new method for measuring the TTC of DIC with simultaneous heating of all logic elements (LE) of DIC by switching them with highfrequency pulses and using all LE DIC as temperature sensors is described, which allows to increase the sensitivity and accuracy of measurement several times, as well as to evaluate the thermal parameters of individual LE in the DIC. The article gives a variant of the device implementing this method. The results of the experimental verification of the method based on the DIC of domestic and foreign production are matching with the results of measuring the TTC of DIC by changing the frequency of the ring generator.
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