Исследование и моделирование процесса подавления биодеградации растворов для химического никелирования

Abstract

The paper considers proliferation of filamentous fungi in electroless nickel plating baths. We determined that it leads to decomposition of processing media and decreased coating deposition rates. We developed a mathematical model for suppressing filamentous fungi growth in electroless nickel plating solutions in the presence of various inhibitors. The model allows us to predict microorganism proliferation rate under the conditions specified. We used experimental data and mathematical simulation as the basis for investigating processing media biodegradation in electroless nickel plating. Our mathematical simulation showed that it is possible to use the Verhulst model to describe the growth kinetics of filamentous fungi colonies. It also allowed us to determine the parameters of the process kinetics, to predict bath electrolyte stability and select efficient inhibitors. We validate our selection of inhibitor substances (copper sulphate, sodium tetraborate, lactic acid, sodium propionate, chloroform) that have a fungistatic or fungicidal effect on biological object proliferation. We developed a mathematical model for the process of inhibiting processing media biodegradation in electroless nickel plating by means of various substances. We substantiate the ambiguity of selecting the initial condition for stating the Cauchy problem in the mathematical description of the process. We present and analyse the results of mathematically simulating the process under consideration. We found sodium tetraborate to be the most efficient biological object proliferation inhibitor, since, as its concentration increases to 50 mmol/l, there is no deterioration in the coating quality; at the same time, the coating deposition rate increases and the necessary fungicidal effect