Abstract
박형 package-on-package에 대해 T/H (temperature/humidity) 시험, TC (temperature cycling) 시험과 HTS(high temperature storage) 시험을 사용하여 신뢰성을 분석하였다. T/H 시험은 <TEX>$85^{\circ}C/85%$</TEX>의 조건으로 500시간, TC 시험은 <TEX>$-40{\sim}100^{\circ}C$</TEX>의 조건으로 1000회, HTS 시험은 <TEX>$155^{\circ}C$</TEX>의 조건으로 1,000시간 범위에서 평가하였다. 폴리이미드 써멀테이프를 사용하여 제작한 24개의 package-on-package (PoP) 시편에 대해 신뢰성 시험 전에 측정한 솔더접속 배선의 평균저항은 <TEX>$0.56{\pm}0.05{\Omega}$</TEX>이었으며, 24개 시편에서 모두 유사한 값이 측정되었다. 500시간까지의 T/H 시험, 1000회의 TC 시험 및 1,000시간까지의 HTS 시험후에도 솔더 접속부의 오픈 불량은 발생하지 않았다. Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at <TEX>$85^{\circ}C/85%$</TEX> for 500 hours, TC (temperature cycling) test at <TEX>$-40{\sim}100^{\circ}C$</TEX> for 1,000 cycles, and HTS (high temperature storage) test at <TEX>$155^{\circ}C$</TEX> for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was <TEX>$0.56{\pm}0.05{\Omega}$</TEX> and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.
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