Abstract
The effect of irradiation with a pulsed electron beam (PEB) in the mode of surface melting absence on the copper diffusion in the near-surface layer of ultrafine-grained (UFG) nickel has been studied. The profiles of the copper concentration distribution over depth after isothermal diffusion annealing and annealing under PEB irradiation of the UFG nickel surface are determined. It has been established that as a result of PEB irradiation, the coefficient of grain-boundary diffusion of copper in nickel increases and the mode of grain-boundary heterodiffusion changes in the near-surface layer of nickel in comparison with isothermal diffusion annealing.
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