매니폴드 구조를 포함하는 마이크로채널의 압력 강하 및 냉각 성능 향상에 관한 수치해석적 연구

Abstract

In this study, the flow characteristics and heat transfer performance of microchannel with layered manifold structure were compared and analyzed theoretically and numerically. For the numerical analysis model, a microchannel with a width of 0.5 mm and a height of 1 mm and a manifold structure were designed at the inlet and outlet, and 25℃water was used as the cooling fluid. The boundary condition of the numerical analysis was performed by applying a flow rate variable of 0.3 ~ 1.1L/min under the heat flux of 31.25W/㎠ to the heat source. As a result of the study, the microchannel with layered manifold showed cooling performance with a temperature difference of 50℃or more under the condition of a pressure drop of less than 0.5 kPa compared to the existing microchannel.