ВИЗНАЧЕННЯ МАКСИМАЛЬНОЇ ГЛИБИНИ УТЯЖКИ СУПЕРТОНКИХ НЕСУЧИХ ОБШИВОК СЕНДВІЧЕВОЇ ПАНЕЛІ СОНЯЧНОЇ БАТАРЕЇ КОСМІЧНОГО ЛІТАЛЬНОГО АПАРАТУ

Abstract

Continuous dimple of super-thin skins are purely specific defects that are found in the process of sandwich panels manufacturing of spacecraft solar batteries. These types of defects, both in terms of the nature of their appearance and in the aspect of reduction (elimination), are currently receiving close attention. An analysis of this type of defect, which occurs in the process of assembling a sandwich structure by gluing super-thin load-bearing skins and cellular aggregate, has been carried out. A mathematical model was developed to estimate these dimples, which takes into account the thermal expansion of the cladding and cellular aggregate at the temperature of the panel gluing, followed by icing and fixation of the glue in a heated state, and then cooling the glued panel to normal temperature. On the basis of this model, analytical dependences for determining the maximum depth of dimple were obtained. It was shown that continuous dimples have a relatively small value and are an inevitable consequence of the optimal design implementation with the exception of the only parameter - the temperature difference during cooling from the panel gluing temperature to normal. Therefore, the use of glues that polymerize at lower temperatures (as well as binders for the manufacture of panel skins) can reduce the dimple size. The research results allow solving a number of new tasks of the technology of assembling a structures made of polymer composite materials for aerospace engineering and can be used in the production of other precision products for conversion purposes.