Abstract
Investigations of the effect of an impurity (silver) segregating along the grain boundaries of nickel on the evolution of the structure and grain-boundary ensemble under conditions of diffusion annealing at a temperature of 823 K for 6 hours have been carried out. It is shown that, under these conditions, the development of a diffusion-induced recrystallization (DIR) process is observed in the Ni(Ag) system, in contrast to the Ni(Cu) system, in which the process of diffusion-induced grain boundary migration (DIGM) was observed. The estimates made have shown that a possible reason for the fact that diffusion-induced migration of grain boundaries practically does not occur in the Ni(Ag) system can be significantly lower than in the Ni(Cu) system the value of osmotic pressure as the driving force for the DIGM process.
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