분할 공동 구조를 이용한 고 종횡비 인쇄회로기판 내 전송선 층 변환 구조의 신호 무결성 개선 설계 및 모델링

Abstract

This paper proposed a layer transition design for high-speed signal transmission in high aspect ratio printed circuit boards (PCBs). The proposed design employed a segmented cavity structure to suppress the group cavity resonance that degrades a wide bandwidth range of high-speed transmission lines with signal vias for layer transition. To predict the transfer characteristic of the proposed design, equivalent circuit models were developed based on the combination of resonant cavity models, lumped via models, and conventional transmission line models. The proposed design and equivalent circuit models were validated with a noticeable improvement in the signal integrity performance by simulation and measurement results up to 30 GHz.