Synergistic mechanism of hydrothermal performance and temperature uniformity in microchannel heat sink with non-uniformly distributed drop-shaped fins

Thermal–electrical and exergy performance analysis of a dish-type HCPV system with porous microchannel heat sink and Al₂O₃–water nanofluid: A CFD–ANN study

A novel hybrid staggered arrangement petal-shaped pin-fin microchannel heat sink for hotspot mitigation

Multi-objective optimization on parallel microchannel heat sink for flow boiling based on distributed parameter modelling: Part 1 – Numerical method and experimental validation

Multi-objective optimization on parallel microchannel heat sink for flow boiling based on distributed parameter modeling: Part 2 – Optimization and performance evaluation

Thermodynamic and computational fluid dynamic analysis of a microchannel heat sink device: Use of nanofluids, effect of pin shape and inclusion vortex generators

Multi-objective optimization of nanofluid flow and heat transfer in the microchannel heat sink with drop-shaped cavities and curved-slot drop-shaped ribs based on machine learning

Effects of multi-manifold structured microchannel heat sink on heat transfer and flow performance

Numerical analysis of enhanced heat transfer and entropy generation in microchannel heat sink equipped with lancet pin fin and protrusion structure for advanced electronic cooling applications

Enhanced thermal performance of glass dual-stage wedge-shaped manifold microchannel heat sinks

Experimental and numerical investigation of liquid-cooled microchannel heat sink by topology optimization for uniform heat source

Performance analysis and structural optimization of the microchannel heat sink for high power multi-chip heat dissipation

Tapered-groove microchannel heat sink with teardrop-shaped ribs for enhanced thermal performance

Multi-objective optimization of a microchannel heat sink with semi-elliptical cavities based on neural network and genetic algorithm

Performance Analysis and Optimization of a Dual-Layer Microchannel Heat Sink Enhanced by Impinging Jets and Fin-Induced Disturbance

Numerical study on design optimization and thermo-hydraulic performance of a novel composite-structure liquid metal manifold microchannel heat sink

Numerical investigation of microchannel heatsink with gradient geometry impacting flow maldistribution and hotspot for thermal management applications

In response to the increasingly severe heat dissipation challenges in electronic devices, three types of manifold microchannel heat sinks (MMC) incorporating rhombic pin-fins were proposed. Under the constraint that the maximum temperature of the heat source surface remains below 343.15 K, numerical comparisons with a conventional straight rectangular microchannel heat sinks (MCHS) reveal that the design featuring a trapezoidal manifold exhibits superior comprehensive thermal performance and improved temperature uniformity. Furthermore, the influence of rhombic pin-fin geometry on thermal performance was investigated for both MCHS with and without the trapezoidal manifold under varying mass flow rates. Results show that for the MCHS without a manifold, performance evaluation criterion (PEC) reaches its maximum when the inlet angle of the rhombic pin-fin is 120°, the side length is 0.17 mm, and the pin-fin height is 0.18 mm. In contrast, for the MCHS with the trapezoidal manifold, optimal PEC is achieved at an inlet angle of 110°, a side length of 0.18 mm, and a pin-fin height of 2.2 mm. Additionally, a multi-objective optimization was conducted using the Latin hypercube sampling method. Three objective functions-maximum temperature (Tmax), thermal performance (PEC), and temperature uniformity (σT)-were considered. A total of 150 sample points were used to train Kriging surrogate models for the rhombic pin-fin MCHS with trapezoidal manifold. The optimization results demonstrate a 34.05% enhancement in thermal performance and an 18.6% improvement in temperature uniformity.

Microchannel liquid cooling technology, characterized by high heat-transfer efficiency, represents an effective solution for thermal management in high heat-flux density electronic devices. Existing research has mainly focused on optimizing the structural design of microchannel heat sinks, while neglecting the specific effects of inlet manifold configurations on their heat transfer and flow performance. To obtain more systematic data on microchannel heat transfer performance and internal velocity distribution, this study designed microchannels with single-inlet and triple-inlet configurations. A microchannel cooling performance testing platform was established, and visualization experiments of the internal flow field in straight microchannels were conducted using a particle image velocimetry (PIV) system. The velocity distribution uniformity and heat transfer performance were compared between single-inlet and triple-inlet microchannels with varying channel spacings. The results show that under the same flow conditions, the triple-inlet splitter structure yields a more uniform flow distribution, a lower peak temperature for the heat source chip, and improved heat transfer performance, with its pressure drop reduced to 11.1-26.6% of that of the single-inlet configuration. Furthermore, smaller channel spacings yield improved heat-transfer efficiency in microchannels.

Development of a cost-effective diamond shim-based microchannel heat sink for power devices