ChemInformVolume 21, Issue 51 Preparative Inorganic Chemistry ChemInform Abstract: Preparation of Silicon Nitride with Good Interface Properties by Homogeneous Chemical Vapour Deposition. B. A. SCOTT, B. A. SCOTT IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorJ. M. MARTINEZ-DUART, J. M. MARTINEZ-DUART IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorD. B. BEACH, D. B. BEACH IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorT. N. NGUYEN, T. N. NGUYEN IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorR. D. ESTES, R. D. ESTES IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorR. G. SCHAD, R. G. SCHAD IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this author B. A. SCOTT, B. A. SCOTT IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorJ. M. MARTINEZ-DUART, J. M. MARTINEZ-DUART IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorD. B. BEACH, D. B. BEACH IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorT. N. NGUYEN, T. N. NGUYEN IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorR. D. ESTES, R. D. ESTES IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this authorR. G. SCHAD, R. G. SCHAD IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NW 10598, USASearch for more papers by this author First published: December 18, 1990 https://doi.org/10.1002/chin.199051024AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinked InRedditWechat No abstract is available for this article. Volume21, Issue51December 18, 1990 RelatedInformation
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