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  • Open Access Icon
  • Research Article
  • 10.5104/jiep.21.99
独立行政法人国立高等専門学校機構小山工業高等専門学校電気電子創造工学科 大島研究室
  • Jan 1, 2018
  • Journal of Japan Institute of Electronics Packaging
  • Shinpei Oshima

  • Open Access Icon
  • Research Article
  • 10.5104/jiep.21.101
2017ワークショップ開催報告
  • Jan 1, 2018
  • Journal of Japan Institute of Electronics Packaging

  • Open Access Icon
  • Research Article
  • 10.5104/jiep.21.c12
Contents
  • Jan 1, 2018
  • Journal of Japan Institute of Electronics Packaging

  • Open Access Icon
  • Research Article
  • 10.5104/jiep.20.308
ハイパフォーマンスコンピュータにおける光インターコネクションの将来展望
  • Jan 1, 2017
  • Journal of Japan Institute of Electronics Packaging
  • Naoki Nakamura

  • Open Access Icon
  • Research Article
  • 10.5104/jiep.20.c61
目次
  • Jan 1, 2017
  • Journal of Japan Institute of Electronics Packaging

  • Open Access Icon
  • Research Article
  • 10.5104/jiep.20.372
LSI上MEMSによるヘテロ集積化
  • Jan 1, 2017
  • Journal of Japan Institute of Electronics Packaging
  • Masayoshi Esashi + 1 more

  • Open Access Icon
  • Research Article
  • 10.5104/jiep.20.286
光トランシーバの動向
  • Jan 1, 2017
  • Journal of Japan Institute of Electronics Packaging
  • Kiyohisa Hiramoto

  • Open Access Icon
  • Research Article
  • 10.5104/jiep.20.c42
Contents
  • Jan 1, 2017
  • Journal of Japan Institute of Electronics Packaging

  • Open Access Icon
  • Research Article
  • 10.5104/jiep.20.24
電子部品の進化と多様化する次世代パッケージ技術
  • Jan 1, 2017
  • Journal of Japan Institute of Electronics Packaging
  • 電子部品・実装技術委員会

  • Open Access Icon
  • Research Article
  • 10.5104/jiep.20.c21
目次
  • Jan 1, 2017
  • Journal of Japan Institute of Electronics Packaging