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Showing 10 of 4,721,471 papers
IAES International Conference on Electrical Engineering, Computer Science and Informatics

Note from EditorsThe 3rd International Conference of Electrical Engineering, Computer Science and Informatics (EECSI) 2016 was held in Semarang, Indonesia from 23th to 25th November, 2016. The conference was organized by Universitas Islam Sultan Agung as the host in collaboration with Universitas Diponegoro, Universitas Ahmad Dahlan and Universitas Sriwijaya, and with full technical support from IAES Indonesia Section. Authors and participants from 10 countries made the conference truly international in scope. Participants have delivered their talks of valuable research outputs that vary from many fields of electrical engineering (power electronics, telecommunication, electronics engineering, control system and signal processing) to the field of computer science and informatics. These wide range of topics have colorized this conference.This volume of IOP Conference Series: Materials Science and Engineering contains selected articles from those presented in the conference. After presentation, the revised papers were peer reviewed by fellow reviewers to ensure the quality of published materials. Finally, Editors decided to select and publish as many as 49 papers. It is hoped that the presented papers can offer more insight towards broad audience.On behalf of Editors, we appreciate enormous work of all staffs and reviewers in the preparation of this volume. We would like to express our sincere thanks to all authors and presenters for their valuable contributions. We hope to see you again in the next event of EECSI 2017 which will be held in Yogyakarta, Indonesia, next year.Guest EditorsMunawar A Riyadi, PhDDr. Sri Arttini Dwi Prasetyowati,Tole Sutikno, PhDDeris Stiawan, PhD

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IAES International Conference on Electrical Engineering, Computer Science and Informatics

The 3 rd International Conference of Electrical Engineering, Computer Science and Informatics (EECSI) 2016 was held in Semarang, Indonesia from 23 th to 25 th November, 2016. The conference was organized by Universitas Islam Sultan Agung as the host in collaboration with Universitas Diponegoro, Universitas Ahmad Dahlan and Universitas Sriwijaya, and with full technical support from IAES Indonesia Section. Authors and participants from 10 countries made the conference truly international in scope. Participants have delivered their talks of valuable research outputs that vary from many fields of electrical engineering (power electronics, telecommunication, electronics engineering, control system and signal processing) to the field of computer science and informatics. These wide range of topics have colorized this conference. This volume of IOP Conference Series: Materials Science and Engineering contains selected articles from those presented in the conference. After presentation, the revised papers were peer reviewed by fellow reviewers to ensure the quality of published materials. Finally, Editors decided to select and publish as many as 49 papers. It is hoped that the presented papers can offer more insight towards broad audience. On behalf of Editors, we appreciate enormous work of all staffs and reviewers in the preparation of this volume. We would like to express our sincere thanks to all authors and presenters for their valuable contributions. We hope to see you again in the next event of EECSI 2017 which will be held in Yogyakarta, Indonesia, next year.

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<title>Vibration control and isolation design for the Electrical Engineering/Computer Science Building, University of Minnesota--Minneapolis, Minnesota</title>

Design of the Electrical Engineering/Computer Science Building at the University of Minnesota included development of a very low vibration environment for research in submicron processes in microelectronics. The new facility which opened in 1988 has 325,000 gross square feet of space on six floors and cost approximately $DLR35 million. The vibration control process consisted of: (1) establishing permissible vibration levels for extremely sensitive equipment, (2) monitoring site vibration, (3) isolating the microelectronics lab, (4) analyzing expected floor motion in the structure using finite element methods, and (5) isolating the HVAC mechanical equipment. The permissible floor vibration for the facility was 100 (mu) in/sec for the microelectronics floor and 1,000 (mu) in/sec for the remainder of the facility. Since there were several large engineering buildings and a main vehicular thoroughfare directly adjacent, vibration measurements taken at the site during the design phase showed the maximum ground surface and floor motion to be 1,350 (mu) in/sec and motion in the bedrock level at only 40 (mu) in/sec. A two-foot thick, solid, reinforced concrete floor was designed for the microelectronics lab, supported on three-foot diameter caissons down to bedrock, spaced on nine-foot centers and isolated from the soil. A computerized structural vibration analysis was completed with a finite element model of a typical bay of the entire building to predict response of the building to ambient and equipment excitation. The results of these predictions along with the building performance test data show the floor motion to be less than permissible levels.

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