Vapour Phase Soldering Research Articles

Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering

The novel micro-coil spring package has become a new choice for reliable applications in extreme temperature change, high-strength impact, long-term vibration and other harsh environments due to the advantages arising from its special packaging design. The study of solder joint shape is an important step in the characterization of the package reliability. By Ansys Fluent software, the finite volume method was applied to investigate the flow behavior of molten solder during vacuum vapor phase soldering and the volume of fluid model was used to track the solder melt front. The simulation results reveal the effect of two critical process parameters (solder volume and pad diameter) on solder joint shape in micro-spring array package. The fillet height of the solder joint increases with decreasing pad diameter and decreases with decreasing solder volume. The optimal solder volume is 0.07 mm3 coupled a pad diameter of 0.80 mm, producing suitable fillet height and nice concave fillet shape, which is in agreement with the real sample of micro-spring soldering joint. The good consistency between experiment and simulation proves that the finite element method can effectively predict the shape of the melted solder. This work paves the way for the optimization of the solder joint shape in the electronic assembly.

Study on the Influence of Vacuum Vapor Phase Soldering Process Technology on SiP Component

Vapor phase soldering (VPS) is used in the assembly of highly reliable electronic products for aerospace, military, and industrial area for the advantages of heat transfer coefficient, good temperature uniformity, and controllable maximum soldering temperature. VPS is usually used for PCB (Printed Circuit Board) and complex components. However, little research has been done on the application of VPS process technology on the SiP (System in Package) component in the process of solder ball or solder column package. In this work, we investigated the influence of the vacuum VPS process on the SiP component. The advantages of VPS and vacuum process were discussed and the maximum shear strength of solder joints in the vacuum process was calculated. The vacuum process has no impact on the internal structure of the SiP component.

Compact numerical modelling of transient condensate layer formation on small components during vapour phase soldering

In this paper transient condensation and heat transfer been investigated on a printed circuit board (PCB) and a surface mounted (SMD) capacitor during a vapour phase reflow soldering (VPS) process. Classic VPS processes provide rapid heating with high heat transfer coefficient rates due to condensation that forms a continuous liquid film on the surfaces. Our aim was to develop a simple and fast computable method that, instead of relying on static descriptions, can reproduce the transient dynamics of the process. It was defined as an inverse heat conduction problem (IHCP) and proposed a solution based on finite difference modelling (FDM) with an alternating direction implicit (ADI) scheme. The layer dynamic was described with a parametric differential equation, and it was coupled to the concentrated and distributed thermal models of the PCB and the capacitor. The parameter values were determined by fitting to measured data. It was found that the heat transfer coefficient is inversely proportional to the layer thickness, and it changes over time according to the dynamic properties of layer growth. It was corroborated that the heat transfer depends on the geometry and thermal properties of the heated surfaces in VPS ovens. The presented method shows good agreement with the validation data. The new method provides a significant update over previous modelling approaches describing the condensation-based heating of the VPS process.

Research on Thermal Simulation Improving the Components’ Soldering Quality in Electronic Module

This paper describes a method that could exactly optimize and improve the soldering quality of the electronic module. Firstly, a sample of temperature measurement was proposed. Through the temperature rising, heat preservation, temperature rising, soldering and cooling, the sensors could able to accurately and sensibly record and present each temperature data which set on the sample. At the same time the soldering cure was also measured. Secondly, through the analysis and research of vapor-phase soldering technology based on condensation theory, referring to the relevant modeling and simulation analysis methods, a thermal simulation model was established (size: 13.7mm × 45mm × 16.5mm). The ANSYS was used in this thermal simulation and the measured temperature curve, material parameters and other boundary conditions were loaded. The transient thermal simulation method was adopted and the temperature variation on sample during vapor-phase soldering was simulated. A maximum error of 2.67°C between simulation and measurement results, error rate is only 1.2%. Therefore, this simulation method can effectively perform the change of temperature with time in the real vapor-phase soldering process. After that, the optimized vapor-phase soldering temperature curve and soldering process parameters were used to carry out the vacuum vapor-phase soldering test in the assembly. The dimensions, materials and other parameters of the components used in the test were completely consistent with the simulation model. Two Sn63Pb37 solder rings were used in the test and the vacuum was also carried out. Through the X-ray inspection results, the optimized vapor phase soldering temperature curve has no soldering voids and well soldering consistency, which meets the requirements of high-quality soldering and improves the assembly quality of electronic products.

Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors

Electronic manufacturing principles are continuously developing, further improving assembly quality and productivity. There is a continuous need to apply novel and improved methods of process monitoring to provide accurate measurement and control during assembling. In this paper, a new principle for monitoring filmwise condensation-based heat-level—vapour phase soldering (HL-VPS) is presented to improve the process control. The experiment is based on thermocouple sensors in fusion with a sensitive gauge type pressure sensor. The aim is to precisely identify the steps of condensation-based reflow heat transfer process with commercially available components and the mindset of possible retrofitting in the generally used HL-VPS soldering ovens. It was found that the gauge sensor can follow the state of the workspace more precisely as the thermocouples, by monitoring the hydrostatic state of the vapour. The pressure (time) function gives information about the build-up of the vapour column, highlighting four characteristic steps (phases) of the process, meaning: immersion of the sample to be soldered, condensation-based heat transfer, solder-break, and cooling. Combined application with thermocouples enables more precise control, improving soldering quality and can reduce idle time of the oven. In addition, it was showed that the gauge type sensors could highlight any failure in the oven sealing by a sensor signal threshold detection. The original concept of workspace identification also fits the present and future industry 4.0 directives.

Compact Numerical Modelling of Transient Condensate Layer Formation on Small Components During Vapour Phase Soldering

Compact Numerical Modelling of Transient Condensate Layer Formation on Small Components During Vapour Phase Soldering

Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces

PurposeThe paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed Circuit Board (PCB) surfaces. The investigation can help develop a better understanding of the process and provide information for future modelling of the process.Design/methodology/approachFor the investigations, flame retardant grade 4 (FR4) PCB plates and sealed plate–based boxes were immersed into saturated vapour of an experimental oven. The temperature and resulting heat transfer coefficients were analysed according to the sample boxes and the surface orientations. In addition, the boxes’ vapour consumption was investigated with pressure measurements.FindingsThe horizontal top- and bottom-side heating shows very similar results. In addition, the sides of a box were heated in a manner similar to the top and the bottom sides, but there was a slight increase in the heat transfer coefficient because of the vertical wall alignment. The pressure measurements reveal the dynamic changes in vapour after immersion of the boxes.Practical implicationsThe findings may help to show differences on different surface orientations, pointing to more precise, explicit and multiphysics simulation results.Originality/valueThe experiments present an aspect of heat transfer coefficient differences in VPS ovens, also highlighting the effect of initial pressure drop inside the workspace of an oven.

Effect of different thermocouple constructions on heat-level vapour phase soldering profiles

PurposeTo improve productivity and reach better quality in assembling, measurements and proper process controlling are a necessary factor. This study aims to focus on the monitoring heat-level-based vapour phase reflow soldering (VPS), where – as it was found – different thermocouple constructions can affect the set parameters of the oven and resulting soldering profiles significantly.Design/methodology/approachThe study experiments showed significant alteration of the heating profiles during the process of the reflowing using different construction of k-type thermocouples. In a heat-level-based VPS oven, polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA) gas and water-resistant, fibreglass, thin PFA and ultrathin PFA-covered thermocouples were tested with ±1 °C precision. The oven parameters were swept according to the heating power; the length of the introduced thermocouple cables was also taken into account. An FR4-based sample PCB was used for monitoring the temperature.FindingsAccording to the results, due to the mass and volume of the thermocouples’ wires, different transients were observed on the resulting soldering profiles on the same sample PCB. The thermocouples with lower thermal mass result in faster profiles and significantly different heating factor values compared to the thermocouples that have larger thermal mass. Consequently, the length of the thermocouple wires put in the oven has also considerable effect on the heat transfer of the PCB inside the oven as well.Originality/valueThe paper shows that the thermocouple construction must be taken into account when setting up a required soldering profile, while the thermal mass of the wires might cause a significant difference in the prediction of the actual and expected soldering temperatures.

Modelling of temperature distribution along PCB thickness in different substrates during reflow

Purpose In this paper, analytical modelling of heat distribution along the thickness of different printed circuit board (PCB) substrates is presented according to the 1 D heat transient conduction problem. This paper aims to reveal differences between the substrates and the geometry configurations and elaborate on further application of explicit modelling. Design/methodology/approach Different substrates were considered: classic FR4 and polyimide, ceramics (BeO, Al2O3) and novel biodegradables (polylactic-acid [PLA] and cellulose acetate [CA]). The board thicknesses were given in 0.25 mm steps. Results are calculated for heat transfer coefficients of convection and vapour phase (condensation) soldering. Even heat transfer is assumed on both PCB sides. Findings It was found that temperature distributions along PCB thicknesses are mostly negligible from solder joint formation aspects, and most of the materials can be used in explicit reflow profile modelling. However PLA shows significant temperature differences, pointing to possible modelling imprecisions. It was also shown, that while the difference between midplane and surface temperatures mainly depend on thermal diffusivity, the time to reach solder alloy melting point on the surface depends on volumetric heat capacity. Originality/value Results validate the applicability of explicit heat transfer modelling of PCBs during reflow for different heat transfer methods. The results can be incorporated into more complex simulations and profile predicting algorithms for industrial ovens controlled in the wake of Industry 4.0 directives for better temperature control and ultimately higher soldering quality.

Influence of a Soldering Process on Thermal Parameters of Large Power LED Modules

In this paper, the results of investigations concerning the influence of a soldering process on the thermal properties of large LED modules are presented. The convection reflow soldering and vapor phase soldering are considered. The quality of the performed connections is evaluated by means of measurements with X-rays and thermal parameters of single diodes contracted in the examined modules, and the whole modules are measured. It is shown that by using the vapor phase soldering, considerably more efficient cooling of the examined LED modules could be obtained, which can increase their lifetime.

Vapour phase soldering (VPS) technology: a review

Purpose This paper aims to present a review of the recent developments in vapour phase soldering (VPS) technology. This study focuses on the following topics: recent developments of the technology, i.e. soft and vacuum VPS; measurement and characterization methods of vapour space, i.e. temperature and pressure; numerical simulation of the VPS soldering process, i.e. condensate layer and solder joint formation; and quality and reliability studies of the solder joints prepared by VPS, i.e. void content and microstructure of the solder joints. Design/methodology/approach This study was written according to the results of a wide literature review about the substantial previous works in the past decade and according to the authors’ own results. Findings Up to now, a part of the electronics industry believes that the reflow soldering with VPS method is a significant alternative of convection and infrared technologies. The summarized results of the field in this study support this idea. Research limitations/implications This literature review provides engineers and researchers with understanding of the limitations and application possibilities of the VPS technology and the current challenges in soldering technology. Originality/value This paper summarizes the most important advantages and disadvantages of VPS technology compared to the other reflow soldering methods, as well as points out the necessary further developments and possible research directions.

Measurement and regulation of saturated vapour height level in VPS chamber

Purpose The purpose of this paper is to investigate measurement and regulation of saturated vapour height level in vapour phase soldering (VPS) chamber based on parallel plate capacitor and retaining a stable saturated vapour level above the boiling fluid, regardless of the quantity and size of assembled components. Design/methodology/approach Development and realisation of capacitance sensor that sensitively senses the maximum height level of saturated vapour above the boiling fluid in the VPS chamber was achieved. Methodology of measurement is based on capacitor change from single air to a parallel plate, filled with two dielectric environments in a stacked configuration: condensed fluid and vapour (air). Findings An easy air plate capacitor immersed in the saturated vapour above the boiling fluid can serve as a parallel plate capacitor owing to the conversion of the air to the parallel plate capacitor. A thin film of fluid between the two capacitor plates corresponds to the height of the saturated vapour, which changes the capacity of the parallel plate capacitor. Originality/value Introducing the capacitive sensor directly into the VPS work space allows to achieve a constant height level of saturated vapour. Based on the capacity change, it is possible to control the heating power. There is a lack of information regarding measurement of stable height of vapour in the industry, and the present article shows how to easily improve the way to regulate the bandwidth of saturated vapour in the VPS process.

Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering

Purpose This paper aims to investigate the self-alignment of 0603 size (1.5 × 0.75 mm) chip resistors, which were soldered by infrared or vapour phase soldering. The results were used for establishing an artificial neural network for predicting the component movement during the soldering. Design/methodology/approach The components were soldered onto an FR4 testboard, which was designed to facilitate the measuring of the position of the components both prior to and after the soldering. A semi-automatic placement machine misplaced the components intentionally, and the self-alignment ability was determined for soldering techniques of both infrared and vapour phase soldering. An artificial neural network-based prediction method was established, which is able to predict the position of chip resistors after soldering as a function of component misplacement prior to soldering. Findings The results showed that the component can self-align from farer distances by using vapour phase method, even from relative misplacement of 50 per cent parallel to the shorter side of the component. Components can self-align from a relative misplacement only of 30 per cent by using infrared soldering method. The established artificial neural network can predict the component self-alignment with an approximately 10-20 per cent mean absolute error. Originality/value It was proven that the vapour phase soldering method is more stable from the component’s self-alignment point of view. Furthermore, machine learning-based predictors can be applied in the field of reflow soldering technology, and artificial neural networks can predict the component self-alignment with an appropriately low error.

Advances in pressure sensing for vapour phase soldering process monitoring

Purpose The purpose of the paper is to improve the control of vapour phase soldering (VPS). To enable better productivity and assembling quality, the industry needs to provide precise control and measurements during assembling. In the paper, a special monitoring method is presented for VPS to enable improved process control and oven state identification. Design/methodology/approach The work presents the investigation of the workspace with dynamic and gage type pressure sensors in fusion with thermocouples. Different sensors were evaluated to find an appropriate type. The relation between the temperature and the pressure was investigated, according to the setup of the oven. The effect of inserting a printed circuit board (PCB) on the pressure of the vapour inside the oven was also investigated with the pressure/power functions. Findings It was found that the novel gage-type sensors enable better precision than solutions seen in previous literature. The sensors are able to monitor the decreasing vapour concentration when a PCB is inserted to the workspace. It was found that there is a suggested minimum power to sustain a well-developed vapour column for soldering in saturated vapour. An inflexion point highlights this in the pressure/power function, in accordance with the temperature/power curve. Originality/value The research presents original works with aspects of a novel sensor fusion concept and work space monitoring for better process control and improved soldering quality.

Board-level vapor phase soldering (VPS) with different temperature and vacuum conditions

Purpose Vapor phase soldering (VPS), also known as condense soldering, is capable of improving the mechanical reliability of solder joints in electronic packaging structures. The paper aims to discuss this issue. Design/methodology/approach In the present study, VPS is utilized to assemble two typical packaging types (i.e. ceramic column grid array (CCGA) and BGA) for electronic devices with lead-containing and lead-free solders. By applying the peak soldering temperatures of 215°C and 235°C with and without vacuum condition, the void formation and intermetallic compound (IMC) thickness are compared for different packaging structures with lead-containing and lead-free solder alloys. Findings It is found that at the soldering temperature of 215°C, CCGA under a vacuum condition has fewer voids but BGA without vacuum environment has fewer voids despite of the existence of lead in solder alloy. In light of contradictory phenomenon about void formation at 215°C, a similar CCGA device is soldered via VPS at the temperature of 235°C. Compared with the size of voids formed at 215°C, no obvious void is found for CCGA with vacuum at the soldering temperature of 235°C. No matter what soldering temperature and vacuum condition are applied, the IMC thickness of CCGA and BGA can satisfy the requirement of 1.0–3.0 µm. Therefore, it can be concluded that the soldering temperature of 235°C in vacuum is the optimal VPS condition for void elimination. In addition, shear tests at the rate of 10 mm/min are performed to examine the load resistance and potential failure mode. In terms of failure mode observed in shear tests, interfacial shear failure occurs between PCB and bulk solder and also within bulk solder for CCGA soldered at temperatures of 215°C and 235°C. This means that an acceptable thicker IMC thickness between CCGA solder and device provides greater interfacial strength between CCGA and device. Originality/value Due to its high I/O capacity and satisfactory reliability in electrical and thermal performance, CCGA electronic devices have been widely adopted in the military and aerospace fields. In the present study, the authors utilized VPS to assemble a typical type of CCGA with the control package of conventional BGA to investigate the relation between essential condition (i.e. soldering temperature and vacuum) to void formation.

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

In this paper, the complex heat transfer process of the vapour phase soldering has been investigated on the level of electronic components. VPS is gaining increased attention lately, and the process needs alternative approaches in modelling, compared to conventional soldering processes in electronics mass manufacturing. Component level modelling was not studied deeply in the literature before, so our focus pointed to heat transfer on large size surface mounted electronic components. Applying the Fourier type heat conduction equation, a detailed 3D thermal model of a polyester capacitor on a printed circuit board was implemented, based on X-ray images of an actual assembly. Our model incorporates inner geometry, material inhomogeneity, composite materials and anisotropic thermal conductivity as important thermal features. Transient heating was calculated with Finite Difference Method combining an alternating direction implicit (ADI) approach, using averaged heat transfer coefficient. Validation measurements were performed in our experimental VPS system. The measured data show good agreement with the calculation results and points to possible application for use in advanced engineering and manufacturing environment.

Reliability studies of InnoLot and SnBi joints soldered on DBC substrate

PurposeThis paper aims to investigate the quality and reliability of solder joints prepared from Pb-free alloys on direct bounded Cu (DBC) substrates. Two types of solder alloys were studied: Sn90.95Ag3.8Cu0.7Sb1.4Ni0.15Bi3.0, with a high melting point of 225°C, and Sn42Bi58, with low a melting point of 138°C.Design/methodology/approachCapacitor components of size 1806 were soldered on DBC substrates by using convection reflow soldering and vacuum vapor-phase soldering technologies. A part of the samples was subjected to the thermal shock test. The structure of the solder joints and the content of the voids were investigated using three-dimensional X-ray tomography. The mechanical strength of the joints was evaluated using the shear force test, and the microstructure of the joints was studied on metallographic cross sections by using scanning electron microscopy.FindingsIt was found that the number of voids is not related directly to the mechanical strength of the solder joints. The mechanical strength of the solder joints depends more on the amount of Ag3Sn precipitation, Au precipitation and the intermetallic layer in the solder joints. In some cases, the thermal shock test caused micro-cracks around the Au precipitation because of a mismatch of Au, AuSn4 and Sn in terms of coefficients of thermal expansion.Originality/valueDBC substrates are usually used for power electronics, where the quality of the solder joints is even more important than in the case of commercial electronics.

Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering

The reflow soldering process of large size components was always problematic in microelectronics manufacturing due to the possibility of component displacement failures after soldering; like tombstone formation or skewing, which can be traced back to the different heating of the opposite component sides. During vapour phase soldering, the efficiency of heat transfer highly depends on the thickness of the condensate layer. In this paper, the inhomogeneity of condensate layer formation and its effects were investigated at large size components during vapour phase soldering by numerical simulations. For this purpose, a 3D computational fluid dynamic model was established. According to the condensate layer formation in different cases, the onset differences in the melting of the solder alloy at the opposite leads of the component were calculated. By the results, the risk of the component displacement during reflow soldering was analysed. It was found, that the congestion of the condensate layer around the large size components can cause considerable differences in the onset of the solder alloy melting, which can yield in component displacement failures after soldering. The extent of difference in the onset of melting depends on the location of the component on the board and on the applied soak temperature. Keep-out zones on the board were suggested to reduce the possibility of the component displacement failures during the vapour phase soldering process.

Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Purpose The vacuum vapour phase soldering method was investigated by numerical simulations. The purpose of this study was to examine the temperature changes of the solder joints during the vapour suctioning process. A low pressure is used to enhance the outgassing of the trapped gas within the solder joints, which otherwise could form voids. However, the system loses heat near the suction pipe during the suctioning process, and it can result in preliminary solidification of the solder joints before the gas could escape. Design/methodology/approach A three-dimensional numerical flow model based on the Reynolds averaged Navier–Stokes equations with the standard k-e turbulence method was developed. The effect of the vapour suctioning on the convective heat transfer mechanism was described by the model. Temperature change of the solder joints was studied at the mostly used substrate and component combinations, as well as at different system settings. Findings In the function of the substrate thickness and the component size, the solder joints can lose large amount of heat during the void reduction process, which leads to preliminary solidification before the entrapped gas voids could be removed. Research limitations/implications The results provide setting information of vacuum vapour phase technology for appropriate and optimal applications. Originality/value The relationship between low pressure generation and convective heat transfer mechanism during vacuum vapour phase soldering has not been studied yet. The possible negative effects of the vapour suctioning process on the solder joint temperature are unknown.

Stability of miniaturized non-trimmed thick- and thin-film resistors

This paper is focused on reliability tests of non-trimmed miniaturized thin-film and thick-film resistors. Thick-film resistors are screen printed by polymer paste on LTCC (Low Temperature Co-fired Ceramic) substrate by two different approaches. Nonstandard precise screen printing process provide tolerance of resistivity less than 5% and thus further trimming is not necessary. OhmegaPly material with Nickel Phosphorous (NiP) metal alloy is used for thin-film resistors fabricated by subtractive process. Miniaturized resistors have dimensions 0.5 × 0.5 mm, and thus 1 square, with thickness 1 μm for thin-film and 20 μm for thick-film resistors. Stability of miniaturized resistors were tested by humidity test, thermal shocks, long-term thermal ageing, direct current stress, current pulses and simulation of soldering process using VPS (Vapour Phase Soldering). Resistivity of resistors is measured by four wire method before and after each set of test and relative change of resistivity is plotted in graphs. Influence of every test on each type of resistor is analysed.