Several passive cooling methods are utilized in electronics cooling. for the sake of their more reliability than active cooling and microchannel heat sink is the device suitable in such present trends of technology. With the evolution of microchannel, researchers predicted that microchannel with double layered pattern is more beneficial in terms of performance. The modification of channel geometry is implemented to get enhanced Nusselt number and heat transfer coefficient. The present work has the objective to implement protrusions on sidewalls of double layered microcahnnel. The influence of protrusions on thermal characteristics along with hydraulic profiles is investigated in the work. Two cases with protruded channel are evaluated and compared with a base smooth sink. Performance parameters are interestingly found superior for both protruded cases. These cases exhibit better Nusselt number and heat transfer coefficient than that of smooth-channel sink at all range of Re. For example, Nu of Case 1 is calculated maximum as 11.13 at the highest Re. In the study of bottom wall temperature, it has been found that convection heat transfer in channel occurs at higher rate due to the presence of protrusions.
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