The reliability of high-density circuit devices may be improved by enhancing the thermal contact conductance at electronic component interfaces. Previous studies involved metallic coatings, anodized coatings, or bulk ceramic materials between electronic components. This study examines the thermal contact conductance of four ceramic coatings, silicon nitride, boron nitride, aluminum nitride, and titanium nitride (TIN) deposited on aluminum 6101-T6 and TiN deposited on copper C11000-H03. The thermal contact conductance of beryllium oxide (BeO) deposited on aluminum 6101-T6 was also experimentally measured. Three of the coatings showed two orders of magnitude improvement when compared to an anodized layer. Experimental thermal conductance values for TiN deposited on copper showed four times the improvement over a nickel-plated coating. A comparison of the coatings to an aluminum 6101-T6 surface in contact with aluminum A356-61 indicates that the titanium nitride coatings have the highest thermal contact conductance and that the coatings only significantly deviate from the bare aluminum case at the higher pressures (greater than 344 kPa). Experimental thermal conductance values for BeO deposited on aluminum 6101-T6 ranged from 1308.7 to 25,688.7 W/m2-K, whereas thermal conductance values for TiN deposited on aluminum 6101-16 in contact with electroplated silver deposited on aluminum A356-T61 varied from 1169.4 to 13,152.1 W/m2-K for the range of parameters tested. The results predicted by the Antonetti and Yovanovich model lie well above the experimental values obtained for both bare surfaces and for several ceramic coatings (titanium nitride and beryllium oxide coatings deposited on aluminum 6101-T6 were the only exception). The thermal contact conductance values for the ceramic and oxide coatings were compared to the predicted results from Yip's model that lie well below the measured values; indicating higher thermal contact conductance.